AHB MultiMatrix Fabric (70107) IP Core
The AHB Fabric provides the necessary infrastructure to connect up to 16 shared AHB Slaves to up to 16 AHB-Lite Bus Masters. The off-the-self configuration ...
Source: design-reuse.com
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AXI Interface Core
Rambus’s AXI Interface Core is designed for use in applications requiring ARM’s Advanced eXtensible Interface (AXI). The core accepts write and read ...
Xtensible Interface Bus Master Memory Controller Bus Functional Read Modify Write Core Ambus Axi Interface Core
Source: design-reuse.com
LPDDR5/LPDDR4 combo PHY on 14nm, 12nm
OPENEDGES is the only total memory system IP company providing Network on-Chip Interconnect (OIC), LPDDR54 Orbit Memory Controller (OMC), and LPDDR54 ...
Source: design-reuse.com
LPDDR54 PHY on Samsung Foundry 14nm
OPENEDGES is the only total memory system IP company providing Network on-Chip Interconnect (OIC), LPDDR54 Orbit Memory Controller (OMC), and LPDDR54 ...
Chip Interconnect Memory Controller Pddr54 Phy On Samsung Foundry 14nm P Core Ilicon Ip Emiconductor Ip
Source: design-reuse.com
LPDDR4 Controller Core
Northwest Logic Low Power Double Data Rate 4 (LPDDR4) Controller Core from Rambus is designed for use in applications requiring high memory throughput, ...
Controller Core Multi Port Front End Reorder Core Lpddr4 Controller Memory Controller Orthwest Logic Lpddr4 Controller Core From Rambus
Source: design-reuse.com
Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm
Share this article (PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 21, 2021 /PRNewswire/ -- Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsungs advanced 14/11nm FinFET process. Leveraging over 30 years of signal integrity expertise, the Rambus solution operates up to 3.2 Gbps, delivering 4...
Jongshin Shin Matt Jones Cori Pasinetti Rambus Corporate Communications Rambus Inc Design Platform Development At Samsung Electronics
Source: prnewswire.com
High Performance DDR4/3 Memory Controller IP Core
High Performance DDR4/3 Memory Controller Mobiveils DDR4/3 Memory Controller is a highly flexible and configurable design targeted for high performance enterprise server and real-time consumer applications that utilize computational elements like graphics controllers, general purpose, digital signal processors, etc. The controller architecture is carefully tailored to achieve reliable high-frequency operation, dynamic power management, error injection and support for rapid system debug. D...
Source: design-reuse.com
AMD Ryzen 9 5980HS Cezanne Review: Ryzen 5000 Mobile Tested
AMD Ryzen 9 5980HS Cezanne Review: Ryzen 5000 Mobile Tested Posted in Since AMD’s introduction of its newest Zen 3 core for desktop users, the implementation for notebooks and mobile users has been eagerly awaited. In a single generation, on the same manufacturing process, AMD extracted +19% more performance per clock (we verified), so for any system that is power limited, extra performance is often very well received. AMD announced its new Ryzen 5000 Mobile processor family at the start of t...
Source: anandtech.com