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GDDR6 PHY - TSMC12FFc IP Core

GDDR6 PHY - TSMC12FFc With the advancement of artificial intelligence (AI), deep neural networks (DNN), ADAS, and high-performance computing (HPC), there is an ever-increasing demand for higher memory bandwidth. Along with the large amount of data generated by these applications, the memory sub-system plays a crucial role in the overall performance. TSS GDDR6 PHY utilizes state-of-the-art architecture in full custom analog mixed-signal design to overcome the problem of long-term impedanc...
Memory Interface Ddr6 Phy Tsmc12ffc Sx Gddr6 Phy P Core Ilicon Ip Emiconductor Ip

Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm

Share this article (PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 21, 2021 /PRNewswire/ -- Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the Rambus HBM2E memory interface subsystem, consisting of a fully-integrated PHY and controller, is silicon proven on Samsungs advanced 14/11nm FinFET process. Leveraging over 30 years of signal integrity expertise, the Rambus solution operates up to 3.2 Gbps, delivering 4...
Jongshin Shin Matt Jones Cori Pasinetti Rambus Corporate Communications Rambus Inc Design Platform Development At Samsung Electronics

Rambus Joins DARPA Toolbox Initiative with State-of-the-Art Security and Interface IP

(PRNewsfoto/Rambus Inc.) SAN JOSE, Calif., April 19, 2021 /PRNewswire/ --  Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced a commercial licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for the agencys programs. The agreement makes all Rambus security, memory interface, and SerDes interface IP products available to DARPA researchers. As licensee...
Serge Leef Cori Pasinetti Rambus Corporate Communications Rambus Inc Microsystems Technology Office Toolbox Initiative

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