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Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions
Ansys receives four awards for joint development of advanced silicon signoff capabilities, 3D-IC prototyping, RF design, and partner collaboration / Key Highlights Ansys secured an award in the.
United states
John lee
Ansys raptor
Mary kate joyce
Dan kochpatcharin
Kelsey debriyn
Ansys exalto
Ansys veloce
Development of millimeter
Ansys inc
Ecosystem forum
Wave design solutions
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Joint development
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