Mujtaba Hamid News Today

Synopsys Cloud OpenLink program delivers ultimate optionality, allowing designers to efficiently access multi-vendor solutions in the Synopsys Cloud environment. Enables highly secure customer entitlements and seamless access to ecosystem partner solutions through an open application programming interface (API). Available immediately to use with proven workflows for Ansys, GlobalFoundries, Keysight Technologies, and Microsoft on Synopsys Cloud.…

The Industrys First Multi-Vendor Environment of EDA, IP, and Foundry Solutions on the Synopsys Cloud Platform Significantly Accelerates Chip Development Highlights: Synopsys Cloud OpenLink...

Highlights: • Enables customers to effectively leverage the Cadence Pegasus Verification System and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform • Initial results demonstrated that the Cadence Pegasus Verification System in the cloud provided optimal performance and reduced cloud compute costs by more than 20% SAN JOSE, Calif., April 17,…

Highlights: Enables customers to effectively leverage the Cadence Pegasus Verification System and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform Initial... | April 17, 2023

Siemens Digital Industries Software has been selected to participate in the Rapid Assured Microelectronics Prototypes (RAMP) Phase II initiative.

MOUNTAIN VIEW, Calif. – July 11, 2022 – Flex LogixÒ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has been selected to be part of a team of microelectronic industry leaders, led by Microsoft, to build a chip development platform with the utmost regard for security as demonstrated by…

Flex Logix Technologies, a supplier of embedded FPGA (eFPGA) IP, architecture and software, has been selected to be part of a team of microelectronic companies, led by Microsoft, to build a chip development platform for security as demonstrated by the DoD RAMP Project.

Cadence Design Systems has released the results of the 2021 three-way collaboration with TSMC and Microsoft, which focused on utilising a cloud infrastructure to accelerate digital timing signoff of 10+ billion transistor designs.

SAN JOSE, Calif., Dec. 2, 2021 -- Cadence Design Systems, Inc. announced the results of the 2021 three-way collaboration with TSMC and Microsoft, which

Highlights: • Customers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform • Cadence Tempus Timing Signoff Solution demonstrated distributed scalability on a 10+ billion transistor design while reducing compute costs for maximum efficiency SAN JOSE, Calif., December 1, 2021—Cadence Design…