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Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets

New Electronics - OCP Foundation and JEDEC announce new collaboration

The Open Compute Project Foundation (OCP) and the JEDEC Solid State Technology Association, a leading developer of standards for the microelectronics industry, have announced a new collaboration.

Open Compute Project Foundation and JEDEC

Open Compute Project and JEDEC develop chiplet common language CDXML

Open Compute Project and JEDEC develop chiplet common language CDXML
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d-Matrix Launches New Chiplet Connectivity Platform to Address Exploding Compute Demand for Generative AI

SANTA CLARA, Calif. Today, d-Matrix, a leader in high-efficiency AI-compute and inference processors, announced Jayhawk, the industry’s first Open Domain-Specific Architecture (ODSA) Bunch of Wires (BoW) based chiplet platform for energy efficient die-die connectivity over organic substrates. Building on the back of the Nighthawk chiplet platform launched in 2021, the 2nd generation Jayhawk silicon…

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