Solid State Technology Association News Today

The specifications for next-gen Low-Power RAM, referred to as LPDDR6, are being finalized. Although the final standard for LPDDR6 should be announced

As the world moves towards power intensive tasks in daily use, it is important to find out why UFS 4.0 storage is the better choice over UFS 3.1.

Suggested stress conditions and test parameters for evaluating TDB reliability of GaN power transistors

Global semiconductor marketplace and search engine Partstack has joined the JEDEC Solid State Technology Association to support the standardisation of semiconductor quality and reliability.

LPCAMM2 is a revolution in RAM, but it faces an uphill struggle

Your next laptop is about to get a massive speed boost

The OCP Summit introduced new Chiplet enablement, advanced Ethernet and device security auditing. Kioxia and Phison discussed data center SSDs and controller technology.

The documents cover the reliability and testing of silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETS).

SANTA CLARA, Calif. – January 24, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems. Eliyan will have…

The non-profit organization Open Compute Project Foundation (OCP), created to make available hyperscale innovations to all. Has this week announced a new