Packaging Show News Today

Garment accessories expo from 11 Jan; 250 exhibitors from 18 countries to display their products at the event

LG Innotek announced that it will participate in the International Electronic Circuits & Packaging Show 2022 held at Songdo Convensia in Incheon from Sept. 21 to 23 and introduce new substrate materials, according to the company, Tuesday. At the exhibition organized by the Korea Electronics Packaging and Circuits Association (KPCA), LG Innotek will unveil three innovative substrate products: flip-chip ball grid array (FC-BGA) substrate, package substrate and tape substrate.