Apple is reportedly testing 3D Fabric Technology as TSMC plans to mass produce 3D Chip stacking packaging by 2027 for Apple and others
In June 2021, Patently Apple posted a report titled "TSMCs 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future." The news was rolled into an Apple patent titled "High Density Interconnection using Fanout Interposer Chiplet." Today were learning that Apple is testing ...
Dfabric Technology D Fabric Technology Patently Apple Chip Design Density Interconnection Fanout Interposer Chiplet
Source: patentlyapple.com