Page 8 - Synopsys Designware News Today

The Synopsys DesignWare® DDR5/4 PHY is a complete physical layer IP interface (PHY) solution for ASIC, ASSP, and system-on-chip (SoC) applications requiring ...

The Synopsys DesignWare® DDR4/3 PHY is a complete physical layer IP interface (PHY) solution for enterprise-class ASIC, ASSP, and system-on-chip (SoC) ...

The voltage monitor is a low power self-contained IP block specially designed to monitor voltage levels within the core logic voltage domains and provide ...

An embedded process detector circuit which helps Integrated Circuit (IC) developers to address the problem of process variability on low-geometry CMOS ...

GlobalFoundries® (GF), the global leader in specialty semiconductor manufacturing, and Synopsys, Inc. (Nasdaq: SNPS) today announced that GF has qualified two key Synopsys reference flows for its 22FDX™ process

Process Detector (For DVFS and monitoring process variation), TSMC N6 An embedded process detector circuit which helps Integrated Circuit (IC) developers to address the problem of process variability on low-geometry CMOS designs. The process detector provides the means to assess process variation from die to die and on chip variation across large die. Process detectors are especially useful in the bring up and characterization phase of new silicon, assessing and compensating for ageing and ...

Winbonds OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP Winbond Electronics has announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP with the companys OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octa...

Temperature Sensor Deep NWELL, TSMC N3 A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an exclusively digital interface and includes a power down function to reduce standby current. The temperature sensor can be instanced multiple times in a single chip. Tight thermal control of device activity is essential for performance optimization, power efficiency and long-term reliability. This In-Chip ...

Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3 Wednesday Jul. 07, 2021 Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3 The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. Thermal activity can be unpredictable and if not monitored carefully can cause over-heating and excessive power consumption which i...

May 27, 2021 Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC’s N3 Process Technology Real-Time Chip Insights Provide Optimized Device Utilization Throughout the Silicon Lifecycle for Leading Market Applications MOUNTAIN VIEW, Calif., May 27, 2021 /PRNewswire/ — Highlights for this Announcement: DesignWare PVT monitoring and sensing subsystem IP supports cutting-edge technologies targeting AI, data center, HPC, consumer and 5G markets In...