Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabricTM Technologies to Boost Productivity for Fast Heterogeneous...
Sanjay Bali Dan Kochpatcharin Kelli Wheeler Design Infrastructure Management Division Synopsys Inc Group At Synopsys
Source: prnewswire.com