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Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform

August 23, 2023

What are typically second- or third-order effects in 2D chip designs are elevated into primary effects in multi-die systems. It’s no wonder, given the ...

System Technology Co System Technology Co Optimization Multi Die System Success Multi Die Systems Integrated Package Co Design Platform Ynopsys Blog Y Kenneth Larsen

Source: design-reuse.com

Intel Shows New Stacked CFET Transistor Design At ITF World

May 18, 2023

Intel’s Ann Kelleher showed a render of the new Complementary FET (CFET) transistor during her presentation at imec’s ITF World conference.

Ann Kelleher Applied Materials Interuniversity Microelectronics Centre Intel Technology Development System Technology Co Technology Development

Source: tomshardware.com

IEDM 2021 Tutorials and Short Courses

August 18, 2021

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM T

United States Wei Lu Benjamin Colombeau Hoi Jun Yoo Hubregt Visser Victor Moroz

Source: electronicsweekly.com

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System Technology Co Optimization News Today

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform

Intel Shows New Stacked CFET Transistor Design At ITF World

IEDM 2021 Tutorials and Short Courses

Explore More Categories