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Indium Corporation Expert to Present at MiNaPAD 2024 June 19-20 · EMSNow

Indium Corporation Expert to Present at MiNaPAD 2024 June 19-20 · EMSNow
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Indium corporation senior global productInternational electronics manufacturing initiativeNemi packaging technology integration groupElectronics packagingElectronics engineersInternational electronics manufacturing technologyInstitute of electricalNational university of singaporeManufacturing minapad forumPackaging society malaysia chapterSenior global product managerAdvanced materialsSze pei limNano electronics packagingPackaging technology integration groupPackaging society malaysia

Circuits Assembly Online Magazine - Indium Corporation s Sze Pei Lim to Present at ICEP Japan

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.

National university of singaporeSingapore generalSouth koreaUnited kingdomMike buetowIndium corporationInstitute of electricalPackaging society malaysia chapterNemi packaging technology integration groupInternational electronics manufacturing initiativeAlloy group hongwen zhangIndium corporation senior global productElectronics engineersInternational electronics manufacturing technologySenior global product managerAdvanced materials sze pei lim

Indium Corporation s Sze Pei Lim to Present at ICEP Japan · EMSNow

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in

United kingdomSouth koreaNational university of singaporeSingapore generalHongwen zhangNemi packaging technology integration groupPackaging society malaysia chapterElectronics engineersMalloy groupInternational electronics manufacturing initiativeInstitute of electricalManufacturing technologyIndium corporationIndium corporation senior global productSenior global product managerAdvanced materials

Circuits Assembly Online Magazine - Indium Corporation Experts to Present at Electronics Packaging Technology Conference

The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 7–9 in Singapore, covers the complete spectrum of electronics packaging technology.

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