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Samsung and SK hynix to use new 1c DRAM on next-gen HBM4 memory for future-gen AI GPUs

The development of the next-gen HBM4 memory standard is happening: Samsung, SK hynix, and TSMC preparing the latest DRAM tech and process nodes.

South-korea
South-korean
Samsung
Samsung-electronics
High-bandwidth-memory
Through-silicon-via

SK hynix and TSMC to work together with HBM4 and next-gen semiconductor packaging technology

SK hynix partners with TSMC to strengthen HBM technological leadership, will work together on next-gen HBM4 and next-gen advanced packaging technology.

South-korea
South-korean
Through-silicon-via
Sk-hynix
Smc
Taiwan-semiconductor-manufacturing-company
K-hynix-tsmc
Bm4
Ext-gen-hbm4
Ai-gpu
Hi-memory

SK hynix Partners with TSMC to Strengthen HBM Technological Leadership

/PRNewswire/ SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recently signed a memorandum of understanding with TSMC for.

South-korea
Seoul
Soult-ukpyolsi
Kevin-zhang
Justin-kim
Operations-office
Deputy-co
Business-development
Through-silicon-via
Senior-vice-president
Overseas-operations-office
Deputy-co-chief-operating

TSMC, Sk Hynix Partner to Strengthen HBM Technological Leadership

TSMC, Sk Hynix Partner to Strengthen HBM Technological Leadership
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Kevin-zhang
Justin-kim
Deputy-co
Business-development
Operations-office
Through-silicon-via
Senior-vice-president
Overseas-operations-office
Deputy-co-chief-operating

SK hynix Partners with TSMC to Strengthen HBM Technological Leadership - (HXSCL)

SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technologySK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performanceProduct Design-Foundry-Memory

South-korea
Luxembourg
Seoul
Soult-ukpyolsi
Korea
Luxemburg
Kevin-zhang
Justin-kim
Deputy-co
Korea-exchange
Business-development
Operations-office

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