Foxconn: Foxconn Teams Up with HCL to Expand India Footprint

Foxconn: Foxconn Teams Up with HCL to Expand India Footprint, Set Up Chip Packaging Plant

Foxconn, Apple's manufacturing giant, is forming a $37.2 million joint venture with HCL Group to establish a semiconductor packaging and testing facility in India. This marks Foxconn's entry into India's Outsourced Semiconductor Assembly and Test (OSAT) sector, aligning with its broader investment plans in India and a strategic shift away from China., Technology & Science News, Times Now

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