Printed Circuit Design & Fab Online Magazine - Rogers Corporation Highlights Advanced Materials at Defense TechConnect Summit & Expo : vimarsana.com

Printed Circuit Design & Fab Online Magazine - Rogers Corporation Highlights Advanced Materials at Defense TechConnect Summit & Expo

Chandler, Arizona, Sept. 19, 2022 – Rogers Corporation (NYSE:ROG) will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the Gaylord National Hotel & Convention Center, in National Harbor, MD, Sept. 27th -28th, 2022. Learn more about Rogers’ multilayer copper clad laminate solutions and formable/shaped dielectric systems designed to meet smaller size, weight, and power (SWaP) requirements in complex electronic assemblies; advanced magneto dielectric systems (MAGTREX® laminates) for impressive miniaturization of antennas and other electromagnetic (EM) assemblies; and novel dielectric composite materials for use in 3D additive manufacturing processes that can expand the performance of antennas and sensor systems. Rogers develops material solutions for enhanced signal integrity (SI), improved EM performance and thermal management of critical electronic applications.

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