Intel’s $3.5B New Mexico Campus Upgrade To Boost Next-Gen Chips The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the company’s new IDM 2.0 strategy it says will lead to processors with greater performance in a smaller footprint. By Dylan Martin May 03, 2021, 02:22 PM EDT Intel plans to invest $3.5 billion to upgrade its New Mexico manufacturing site with capabilities to produce next-generation processors that make use of the chipmaker’s Foveros 3D packaging technology – a crucial change in how Intel will make chips in the future.