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New packaging technology to improve the performance and ther
New packaging technology to improve the performance and ther
New packaging technology to improve the performance and thermals of the Exynos 2400 SoC
Samsung Foundry is expected to use a new packaging technology to improve the performance of the Exynos 2400 chipset.
Related Keywords
China ,
Samsung Exynos ,
Samsung ,
Qualcomm ,
Galaxy Soc ,
Samsung Foundry ,
Fan Out Wafer Level Packaging ,
Flip Chip Ball Grid Array ,
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