Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC S

Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in- Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in- Package while delivering the performance and flexibility expected from the Zynq UltraScale+…

Related Keywords

Houston , Texas , United States , Hanneke Krekels , Greg Sheridan , Zynq Ultrascale , Brian Mulhearn , Xilinx Vitis , Design Service Partner , Xilinx , Adaptive Embedded Computing Group , Beta Program , Octavo Systems , Integrated Circuit , Xilinx Zynq , Flexible Power , Core Vertical Markets , Embedded Computing Group , Xilinx Vivado Design Suite , Xilinx Premier Design Service Partner , Embedded Software , Embedded Solutions , Display Port , Petalinux Distribution , Engineering Samples ,