Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI ™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius ™ Thermal Solver and Clarity ™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI). For more information, visit www.cadence.com/go/samsungadvpkg.