By Baek Byung-yeul Samsung Electronics is further deepening its technology moat in the semiconductor sector as the Korean tech giant is set to complete test verification of next-generation memory chips that feature artificial intelligence (AI) technology. The world's largest memory chipmaker has developed high bandwidth memory (HBM) integrated with AI processing power, called HBM-PIM, for the first time in the industry. The new processing-in-memory (PIM) architecture brings powerful AI processing capabilities inside high-performance memory. The new product enables existing computing system to process data much faster while data doesn't need to be moved to a main CPU for processing, the company said.