Share this article Share this article ALBANY, N.Y., May 25, 2021 /PRNewswire/ -- Ultra-low alpha metal is extensively utilized in advanced solder bumping applications, which are known as common features of avant-garde flip chip and 3D wafer-level chip packages. Automotive, aviation, medical, telecommunication, and electronics are some of the key end-user industries from which the global ultra-low alpha metal market is expected to gather promising sales avenues in the forthcoming years. According to researchers at Transparency Market Research, the global ultra-low alpha metal market is likely to show growth at promising CAGR of 7.5% throughout the assessment period 2019–2027. The total valuation of the market was around US$ 3.0 Bn in 2018.