Winbond joins UCIe Consortium to support high-performance ch

/PRNewswire/ -- Winbond has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium, the industry Consortium dedicated to advancing UCIe...

Related Keywords

Taiwan , China , Germany , Japan , United States , Hong Kong , Israel , Debendra Das Sharma , Chih Chung Chou , Ucie Consortium , Winbond Electronics Corporation , Universal Chiplet Interconnect Express , Artificial Intelligence , Hsiang Yun Fan , Electronics Corporation , Code Storage Flash , Secure Flash , Central Taiwan Science Park , Winbond Electronics ,