Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek. FREMONT, Calif. (PRWEB) April 05, 2021 YES (Yield Engineering Systems, Inc.), a preferred supplier of process equipment for the semiconductor advanced packaging, life sciences and display markets, today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd., one of the leading testing and bump houses in Taiwan. The system will be utilized for advanced packaging mass production processes such as copper pillar and WLP to support growth driven by 5G applications, cloud servers and data centers. Winstek received its first VertaCure XP in September of 2020; this repeat order is expected to be delivered in the 2nd quarter of 2021, in order to serve growing market demand.