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OIDA Virtual Workshop on Developments in Co-Packaging Technologies for Data Centers - Vimarsana News

OIDA Virtual Workshop on Developments in Co-Packaging Technologies for Data Centers

Highly-Anticipated Event will Address Integration of Photonic Functionality into Data Center Roadmaps WASHINGTON – Photonics technologies have been shown to address some of the emerging challenges with data centers. But widespread deployment is still impeded by significant technical, manufacturing and cost barriers. An OSA Industry Development Associates (OIDA) virtual workshop, to be held 30 – 31 March 2021, will review issues embedded photonics must overcome to be considered a viable mass market technology. Leading decision makers overseeing the development of next generation data cente...