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MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference

MacDermid Alpha Presents Solder Paste Solutions for PV Cell Interconnection at EU PVSEC Conference
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Naraharis Pujari , Macdermid Alpha , Senior Global Technology , Assembly Division Of Macdermid Alpha Electronics Solutions , European Pv Solar Energy Conference , Assembly Division , Macdermid Alpha Electronics Solutions , Interconnecting Structured Ribbons , Back Side , Energy Conference , Senior Global Technology Manager , Innovative Approaches , Module Concepts Oral Presentations ,

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo & Tech Forum

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Ohio Valley Expo & Tech Forum
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MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Expo

MacDermid Alpha Electronics Solutions to Feature High Reliability Solutions at SMTA Expo
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United States , Paul Salerno , Macdermid Alpha , Assembly Division Of Macdermid Alpha Electronics Solutions , Ohio Valley Expo Tech Forum On , Assembly Division , Macdermid Alpha Electronics Solutions , Valley Expo , Tech Forum , Holiday Inn , Dermid Alpha , Global Portfolio , Consumer Goods , Metals Reclamation , ஒன்றுபட்டது மாநிலங்களில் , பால் ஸலர்நொ , சட்டசபை பிரிவு , பள்ளத்தாக்கு எக்ஸ்போ , தொழில்நுட்பம் மன்றம் , விடுமுறை சத்திரம் , உலகளாவிய போர்ட்‌ஃபோலீயோ , நுகர்வோர் பொருட்கள் ,

MacDermid Alpha Presents Technical Paper at SMTA China South Technical Conference

MacDermid Alpha Presents Technical Paper at SMTA China South Technical Conference
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Jackson Chan , Macdermid Alpha , Senior Technical Service , China South Technology Conference , Assembly Division Of Macdermid Alpha Electronics Solutions , Macdermid Alpha Electronics Solutions , Shenzhen Convention Exhibition Center , Assembly Division , Two Solder Paste Alloys With , South Technical Conference , Senior Technical Service Manager , Shenzhen Convention , South Technology , ஜாக்சன் சான் , மூத்தவர் தொழில்நுட்ப சேவை , சீனா தெற்கு தொழில்நுட்பம் மாநாடு , ஷென்சென் மாநாடு கண்காட்சி மையம் , சட்டசபை பிரிவு , தெற்கு தொழில்நுட்ப மாநாடு , மூத்தவர் தொழில்நுட்ப சேவை மேலாளர் , ஷென்சென் மாநாடு , தெற்கு தொழில்நுட்பம் ,

MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials

MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Both ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills which are designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CU21-3240 exhibits good thermal cycling performance due to its low coefficient of thermal expansion. It is suitable for applic ....

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