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Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials

Published: September 18, 2023

Intel showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects.

Source: wccftech.com

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United StatesBabak SabiIntel CorporationTeam BlueIntel AssemblyTest Technology DevelopmentGlass SubstrateBringing Significant InterconnectIntel Senior