Intel Foundry Collaborating With Cadence On SoC Designs Using Cutting-Edge 18A Process
Intel has announced the expansion of its collaboration with Cadence on the development of SoCs based on the cutting-edge 18A process node.
Source: wccftech.com
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Next-Gen Intel Chips Will Feature More Sand As Glass Is Set To Replace Organic Substrate Materials
Intel showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects.
Source: wccftech.com
Intel Reaches Foundry Deal With Tower Semiconductor, Investment Reaches Up To $300 Million
Intel Foundry and Tower Semiconductor have reportedly agreed on collaboration, as both companies previously exited from a $5.4 billion deal.
Source: wccftech.com
Chiplets Emerge to Package Multiple Functions
Here are some examples of chiplets either demonstrated or used in production ICs.
Source: designnews.com
英特尔架构日重磅：甩出11大芯片硬科技，推千亿晶体管SoC
英特尔架构日重磅：甩出11大芯片硬科技，推千亿晶体管SoC,英特尔,处理器,gpu,cpu
Source: 163.com