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SAN DIEGO and GRENOBLE, France – Feb. 20, 2024 – University of California San Diego and CEA-Leti scientists report they have developed a ground-breaking [...]
Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions to Accelerate Semiconductor Device Development for Applied’s ICAPS CustomersSANTA CLARA, Calif. and GRENOBLE, France, Dec....
Intel CEO Pat Gelsinger Heads Roster of Speakers in Opening Plenary Session; Workshops Will Focus on Tech Sectors that Address Ecological, Security and Computing Challenges CEA-Leti research engineers
GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla. The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch)…
A technologically advanced urban setting known as a "smart city" employs the ubiquitous connection among numerous digital devices and sensors to enhance urban development projects and collect data. In turn, the data and information improve operations throughout the city.