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Nvidia to embrace TSMC 3D SoIC tech

Nvidia is expected to use 3D (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market. ....

Hips Components , C Design , C Manufacturing ,

Intel delivers MCP prototypes to US Department of Defense

Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program. ....

Hips Components , C Design , C Manufacturing , Pat Gelsinger , R D , Supply Chain ,

JCET reports record revenue, profit for 2022

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91 billion) and CNY3.23 billion. EPS for the year came to CNY1.82. ....

Jiangsu Changjiang Electronics Technology , Advanced Packaging , Automotive Electronics , Cash Flow , Hips Components , Heterogeneous Integration , High Value Added , C Manufacturing , Jiangsu Changjiang Electronics Technology , Wafer Level Packaging ,