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Flex Power Modules teams up with onsemi to develop ultra-small Intermediate Bus Converter - Vimarsana News

Flex Power Modules teams up with onsemi to develop ultra-small Intermediate Bus Converter

Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October. Developed in collaboration with onsemi, the non-isolated and unregulated BMR313 delivers a peak power rating of 3 kW in an ultra-small package, just 23.4…

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification. - Vimarsana News

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification.

A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply ch...

Related Topics:
United StatesDirk Van SlykeBill CarterTom HackenbergComputing DivisionComputing Software SemiconductorDomain Specific ArchitectureHigh Bandwidth InterconnectHigh Bandwidth MemoryPrincipal AnalystSoftware SemiconductorOpen Compute ProjectChief MarketingCentral TimeCompute ProjectA Chiplet Interconnection Specification Optimized For Maximum Applicability Enabling Low Cost And Energy Efficient Implementations AustinJuly 20022 Prnewswire TodayHe Ocp FoundationHe Nonprofit Organization Bringing Hyperscale Innovations To AllNnounced The Release Of Bunch Wires Bow Specification For Chiplet Interconnect Representsa Next Step In Ocp Open Domain Specific Architecture Odsa Project 39 Smarch Towards Establishing An Ecosystem Asa Catalyst Fora New Silicon Market Place And Integrated Circuit Supply Chain Model Specifiesa Physical Layer Phy Optimized System Ona Chip Soc DisaggregationNd Complements Ocp Odsa Open High Bandwidth Interconnect Openhbi Physpecification Targeting Memory And Other Parallel Intensive Use Cases Quot The Demand For Specialized Silicon Has Been Increasing Steadily Due To Workload DiversityUch As With The Adoption Of Ai And MlNd We Expect This Trend To Continue For Several Years In Response Demand The Ocp Recognizes That It Must Bea Catalyst Establish Open And Standardized Chiplet Ecosystems New Markets By Investing Interconnect Technology Will Enable Composable Silicon Release Of Bow Specification Is An Important Step Direction Increase Our Efforts On Developing Supply Chain ModelsUot Said Bill Carter
Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification. - Vimarsana News

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification.

/PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)...

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification. - Vimarsana News

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification.

/PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)...

Data Center Liquid Cooling Market by Component, End User, Data Center Type, Type of Cooling, Enterprise and Region - Vimarsana News

Data Center Liquid Cooling Market by Component, End User, Data Center Type, Type of Cooling, Enterprise and Region

/PRNewswire/ -- The 'Global Data Center Liquid Cooling Market by Component (Solution and Services), End User (Cloud Providers, Colocation Providers,...