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The Open Compute Project Foundation (OCP) and the JEDEC Solid State Technology Association, a leading developer of standards for the microelectronics industry, have announced a new collaboration.
The non-profit organization Open Compute Project Foundation (OCP), created to make available hyperscale innovations to all. Has this week announced a new
January 24, 2023 – Today, the Open Compute Project Foundation (OCP), the hyperscle nonprofit organization, and JEDEC Solid State Technology [...]
A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply ch...
/PRNewswire/ -- Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)...