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New Electronics - OCP Foundation and JEDEC announce new collaboration

The Open Compute Project Foundation (OCP) and the JEDEC Solid State Technology Association, a leading developer of standards for the microelectronics industry, have announced a new collaboration. ....

Cliff Grossner , John Kelly , Tom Hackenberg , Yole Group , Computing Division , Computing Software Semiconductor , Data Extensible Markup Language , Part Model Guidelines , Open Domain Specific Architecture , Open Compute Project , Chiplet Economy , Principal Analyst , Software Semiconductor ,

Open Compute Project Foundation and JEDEC

The non-profit organization Open Compute Project Foundation (OCP), created to make available hyperscale innovations to all. Has this week announced a new ....

Cliff Grossner , Tom Hackenberg , Data Center , Technology News , Yole Group , Computing Division , Solid State Technology Association , Computing Software Semiconductor , Open Compute Project , Open Compute Project Foundation , State Technology Association , Open Domain Specific Architecture , Data Extensible Markup Language , Part Model Guidelines , Principal Analyst , Software Semiconductor , Personal Data Processing , Enterprise Data Processing , Geeky Gadgets ,

OCP and JEDEC Announce Collaboration - High-Performance Computing News Analysis

January 24, 2023 – Today, the Open Compute Project Foundation (OCP), the hyperscle nonprofit organization, and JEDEC Solid State Technology [.] ....

Cliff Grossner , John Kelly , Tom Hackenberg , Data Center , Yole Group , Computing Division , Solid State Technology Association , Computing Software Semiconductor , Open Compute Project Foundation , State Technology Association , Data Extensible Markup Language , Part Model Guidelines , Open Domain Specific Architecture , Open Compute Project , Personal Data Processing , Enterprise Data Processing , Chiplet Economy , Principal Analyst , Software Semiconductor ,

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification.

A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High Bandwidth Interconnect (OpenHBI) PHYspecification targeting High Bandwidth Memory and other parallel bandwidth intensive use cases. "The demand for specialized silicon has been increasing steadily due to workload diversity, such as with the adoption of AI and ....

United States , Dirk Van Slyke , Bill Carter , Tom Hackenberg , Computing Division , Computing Software Semiconductor , Domain Specific Architecture , High Bandwidth Interconnect , High Bandwidth Memory , Principal Analyst , Software Semiconductor , Open Compute Project , Chief Marketing , Central Time , Compute Project , A Chiplet Interconnection Specification Optimized For Maximum Applicability Enabling Low Cost And Energy Efficient Implementations Austin , July 20 , 022 Prnewswire Today , He Ocp Foundation , He Nonprofit Organization Bringing Hyperscale Innovations To All , Nnounced The Release Of Bunch Wires Bow Specification For Chiplet Interconnect Representsa Next Step In Ocp Open Domain Specific Architecture Odsa Project 39 Smarch Towards Establishing An Ecosystem Asa Catalyst Fora New Silicon Market Place And Integrated Circuit Supply Chain Model Specifiesa Physical Layer Phy Optimized System Ona Chip Soc Disaggregation , Nd Complements Ocp Odsa Open High Bandwidth Interconnect Openhbi Physpecification Targeting Memory And Other Parallel Intensive Use Cases Quot The Demand For Specialized Silicon Has Been Increasing Steadily Due To Workload Diversity , Uch As With The Adoption Of Ai And Ml , Nd We Expect This Trend To Continue For Several Years In Response Demand The Ocp Recognizes That It Must Bea Catalyst Establish Open And Standardized Chiplet Ecosystems New Markets By Investing Interconnect Technology Will Enable Composable Silicon Release Of Bow Specification Is An Important Step Direction Increase Our Efforts On Developing Supply Chain Models , Uot Said Bill Carter , Cp Foundation The Odsa Bow Phy Specification Is Optimized For Both Commodity Organic Laminate And Advanced Packaging Technologies ,

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification. – Padovanews

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification. – Padovanews
padovanews.it - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from padovanews.it Daily Mail and Mail on Sunday newspapers.

United States , Contactdirk Van Slykeopen , Bill Carter , Tom Hackenberg , Computing Division , Computing Software Semiconductor , Domain Specific Architecture , High Bandwidth Interconnect , High Bandwidth Memory , Principal Analyst , Software Semiconductor , Open Compute Project Foundationat , Open Compute Project , Chief Marketing , Central Time ,