Nd We Expect This Trend To Continue For Several Years In Response Demand The Ocp Recognizes That It Must Bea Catalyst Establish Open And Standardized Chiplet Ecosystems New Markets By Investing Interconnect Technology Will Enable Composable Silicon Release Of Bow Specification Is An Important Step Direction Increase Our Efforts On Developing Supply Chain Models News Today : Breaking News, Live Updates & Top Stories | Vimarsana

A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High Bandwidth Interconnect (OpenHBI) PHYspecification targeting High Bandwidth Memory and other parallel bandwidth intensive use cases. "The demand for specialized silicon has been increasing steadily due to workload diversity, such as with the adoption of AI and ....

United States , Dirk Van Slyke , Bill Carter , Tom Hackenberg , Computing Division , Computing Software Semiconductor , Domain Specific Architecture , High Bandwidth Interconnect , High Bandwidth Memory , Principal Analyst , Software Semiconductor , Open Compute Project , Chief Marketing , Central Time , Compute Project , A Chiplet Interconnection Specification Optimized For Maximum Applicability Enabling Low Cost And Energy Efficient Implementations Austin , July 20 , 022 Prnewswire Today , He Ocp Foundation , He Nonprofit Organization Bringing Hyperscale Innovations To All , Nnounced The Release Of Bunch Wires Bow Specification For Chiplet Interconnect Representsa Next Step In Ocp Open Domain Specific Architecture Odsa Project 39 Smarch Towards Establishing An Ecosystem Asa Catalyst Fora New Silicon Market Place And Integrated Circuit Supply Chain Model Specifiesa Physical Layer Phy Optimized System Ona Chip Soc Disaggregation , Nd Complements Ocp Odsa Open High Bandwidth Interconnect Openhbi Physpecification Targeting Memory And Other Parallel Intensive Use Cases Quot The Demand For Specialized Silicon Has Been Increasing Steadily Due To Workload Diversity , Uch As With The Adoption Of Ai And Ml , Nd We Expect This Trend To Continue For Several Years In Response Demand The Ocp Recognizes That It Must Bea Catalyst Establish Open And Standardized Chiplet Ecosystems New Markets By Investing Interconnect Technology Will Enable Composable Silicon Release Of Bow Specification Is An Important Step Direction Increase Our Efforts On Developing Supply Chain Models , Uot Said Bill Carter , Cp Foundation The Odsa Bow Phy Specification Is Optimized For Both Commodity Organic Laminate And Advanced Packaging Technologies ,