Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers
Mobiveil HYPERRAM Controller Leverages Winbond’s HYPERBUS-based HYPERRAM x8/x16 with 250 MHz Memory Device Targets Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless headsets, Smart Speakers, Connectivity Applications MILIPITAS, CALIF. –– August 2, 2023 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to…
Source: eejournal.com