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Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controll
Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controll
Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers
Mobiveil HYPERRAM Controller Leverages Winbond’s HYPERBUS-based HYPERRAM x8/x16 with 250 MHz Memory Device Targets Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless headsets, Smart Speakers, Connectivity Applications MILIPITAS, CALIF. –– August 2, 2023 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to…
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