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Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation - Vimarsana News

Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation

SAN JOSE, Calif., April 25, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with TSMC to optimize the Cadence® Virtuoso® platform for the 79GHz mmWave design reference flow on TSMC’s N16 process. With this latest development in Cadence and TSMC’s long history of collaboration, joint customers now have access to a complete…

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies - Vimarsana News

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

SAN JOSE, Calif., April 26, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the…

New Electronics - Cadence and TSMC look to accelerate radar, 5G and wireless Innovation - Vimarsana News

New Electronics - Cadence and TSMC look to accelerate radar, 5G and wireless Innovation

Cadence Design Systems is working with TSMC to optimise its Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.

New Electronics - Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems - Vimarsana News

New Electronics - Synopsys, TSMC and Ansys to collaborate on advanced multi-die systems

Synopsys has announced that it is strengthening its collaboration with TSMC and Ansys for multi-die system design and manufacturing.

Ansys Joins Cloud Alliance - Digital Engineering - Vimarsana News

Ansys Joins Cloud Alliance - Digital Engineering

Combining electronic design automation (EDA) parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating cloud-optimized design methodologies.