The Governments of Canada and Quebec join IBM to invest $187M in the semiconductor industry
The move aims to advance packaging capabilities and conduct R&D for scalable manufacturing and advanced assembly processes.
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The move aims to advance packaging capabilities and conduct R&D for scalable manufacturing and advanced assembly processes.
IBM announced agreements with the Canadian government to develop semiconductor capabilities, despite positive remarks from Prime Minister Trudeau and IBM's focus on enhancing packaging and manufacturing methods.
IBM, the Government of Canada, and the Government of Quebec announced agreements that will strengthen Canada's semiconductor industry, and further develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules to be used across a wide range of applications including telecommunications, high performance computing, automotive, aerospace & defence, computer networks, and generative AI, at IBM Canada's plant in Bromont, Quebec. The agreements reflect a combined investment valued at approximately $187M CAD.
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