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SK hynix signs investment agreement of advanced chip packaging

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Gov. Holcomb, IEDC Announce Generational Multi-billion-dollar Investment to Make Indiana Leader in Semiconductor Packaging

Gov. Holcomb, IEDC Announce Generational Multi-billion-dollar Investment to Make Indiana Leader in Semiconductor Packaging
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SK Hynix Reveals $3.8 bn Investment in Indiana for AI Chip Facility

SK Hynix Reveals $3.8 bn Investment in Indiana for AI Chip Facility
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SK Hynix Announces Semiconductor Advanced Packaging Investment in Purdue Research Park

SK Hynix Announces Semiconductor Advanced Packaging Investment in Purdue Research Park
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