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Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow – EEJournal - Vimarsana News

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow – EEJournal

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated…

RS Group selects Siemens' EDA simulation technology for new cloud native DesignSpark Circuit Simulator - Vimarsana News

RS Group selects Siemens' EDA simulation technology for new cloud native DesignSpark Circuit Simulator

Powered by Siemens' PartQuest software, RS DesignSpark Circuit Simulator is a comprehensive cloud native environment for designing, modeling, simulating and analyzing electronic/mechatronic circuits and systems1.3 million DesignSpark community members will

New Electronics - Siemens brings real-time supply chain intelligence to its Xcelerator portfolio - Vimarsana News

New Electronics - Siemens brings real-time supply chain intelligence to its Xcelerator portfolio

Siemens Digital Industries Software is integrating the Supplyframe Design-to-Source Intelligence platform with its Xcelerator portfolio of software and services.

New Electronics - Siemens delivers 3D verification workflow for fan-out wafer-level packaging - Vimarsana News

New Electronics - Siemens delivers 3D verification workflow for fan-out wafer-level packaging

Siemens Digital Industries Software has collaborated with the Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries (SPIL) in the development and implementation of a new 3D verification workflow.

New Electronics - Siemens and UMC develop 3D integrated circuit hybrid-bonding workflow - Vimarsana News

New Electronics - Siemens and UMC develop 3D integrated circuit hybrid-bonding workflow

Siemens Digital Industries Software, in collaboration with semiconductor foundry United Microelectronics (UMC), has developed and implemented a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.