Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow – EEJournal
Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated…
Source: eejournal.com
