Backside Power Delivery by imec
Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology
Source: electronicsweekly.com
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Imec's backside power delivery for logic
Imec has presented an experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (
Source: electronicsweekly.com
New Electronics - Imec demonstrates backside power delivery with back- and frontside routing
At this week’s 2022 IEEE VLSI Symposium on Technology and Circuits, imec is presenting the first experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (nTSVs) landing on buried power rails (BPRs).
Source: newelectronics.co.uk
Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform
Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive…
Source: eejournal.com
Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform
SAN JOSE, Calif., Oct. 7, 2021 — Cadence Design Systems, Inc. announced the delivery of the Cadence Integrity 3D-IC platform, the industry’s first
Source: hpcwire.com