Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform
Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive…
Source: eejournal.com