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EV GROUP DOUBLES THROUGHPUT OF INNOVATIVE SEMICONDUCTOR LAYER TRANSFER TECHNOLOGY WITH NEW EVG®880 LayerRelease™ SYSTEM

Published: May 28, 2024

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform incorporating EVG's innovative infrared (IR) LayerRelease™ technology. Providing a two-fold increase in throughput compared to the previous-generation platform, the EVG880 LayerRelease system enables nanometer-precision release of bonded, deposited or

Source: yahoo.com

Photolithography Market Trends and Opportunities to 2030:

Published: May 17, 2024

Dublin, May 17, 2024 (GLOBE NEWSWIRE) -- The

Source: globenewswire.com

Semiconductor Manufacturing Equipment Market Surges Towards USD 205.11 billion by 2030 As Revealed In New Report

Published: May 1, 2024

Semiconductor Manufacturing Equipment Market Size, Share, Growth, Trend, Global Industry Overview and Regional Analysis, Forecast 2023 - 2030

Source: whatech.com

Thin Wafer Market Trends and Dynamics 2030

Published: April 1, 2024

Thin Wafer Market by Wafer Size, Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology (Grinding, Polishing, and Dicing), Application (MEMS, CIS, Memory, RF Devices, LED), by Region – Global Share and Forecast to 2030

Source: briefingwire.com

Latest issue of Semiconductor Today now available

Published: March 31, 2024

Compound Semiconductor news by Semiconductor Today free online magazine

Source: semiconductor-today.com