Source Ev Group News Today : Breaking News, Live Updates & Top Stories | Vimarsana

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform incorporating EVG's innovative infrared (IR) LayerRelease™ technology. Providing a two-fold increase in throughput compared to the previous-generation platform, the EVG880 LayerRelease system enables nanometer-precision release of bonded, deposited or

Expanded collaboration includes installation of EVG's LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems

/PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...

Successful full-system die-to-wafer transfer at EVG's Heterogeneous Integration Competence Center demonstrates important step forward in achieving process maturity ST. FLORIAN, Austria, July 27, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in...