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Toppan Photomask Co. Ltd., the world's premier photomask provider, and EV Group (EVG), a leading provider of wafer bonding and lithography...
Successful full-system die-to-wafer transfer at EVG's Heterogeneous Integration Competence Center demonstrates important step forward in achieving process maturity ST. FLORIAN, Austria, July 27, 2022 /PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in...
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications ST. FLORIAN, Austria and JERUSALEM
Breakthrough wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom
YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVG's NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equi...