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EV Group Revolutionizes 3D Integration - Vimarsana News

EV Group Revolutionizes 3D Integration

EV Group (EVG) introduced NanoCleave™ today, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing.

Source: azom.com
EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology - Vimarsana News

EV Group Revolutionizes 3D Integration from Advanced Packaging to Transistor Scaling with NanoCleave Layer Release Technology

/PRNewswire/ -- EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...