China must pursue chip assembly, packaging breakthroughs to catch up with semiconductor leaders, experts say
news China must pursue chip assembly, packaging breakthroughs to catch up with semiconductor leaders, experts say Iris Deng iris.deng@scmp.com © Bloomberg China’s semiconductor industry has an opportunity to expand by focusing on advanced chip assembly and packaging technologies. Photo: Bloomberg China must pursue breakthroughs in chip assembly and packaging technologies to catch up with global industry leaders, according to experts who spoke on Wednesday at the World Semiconductor Conference held in the eastern city of Nanjing. The world's second-largest economy now has ...
Source: msn.com