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When we talk about what's next in chip design, the first things that come to mind are more cores, increased clock speeds, smaller nodes, and more cache. Rarely do we think about the package substrate, the CPU part that holds and links all of its components. However, CPU manufacturers also try to innovate that particular …
Intel has announced a a glass substrate breakthrough, which will make its future chips faster and more efficient.
Intel has revealed more details on its "breakthrough" glass substrate technology - a new way to manufacture processors that will dramatically boost performance
Intel showcased its next-gen Glass Substrate packaging technology which will replace existing organic materials & offer higher interconnects.
(This story has not been edited by THE WEEK and is auto-generated from a PTI