Global Unichip Corp Via Public Guc Announces Glink 3d Die On Interface Ip Using Tsmc N5 And N6 Process For 3dfabric Advanced Packaging Technology News Today : Breaking News, Live Updates & Top Stories | Vimarsana

05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14
GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology
Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC s N5 and N6 processes and 3DFabric™advanced packaging technology for AI, HPC, and Networking applications.
AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when scaled to N5/N3 process nodes but SRAM scaling from N7 to N5/N3 is moderate. SRAM/Logic disintegration allows the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC 3DFabric packaging technology. Such expandable SRAM and modular com ....

United States , Ken Chen , Igor Elkanovich , Taiwan Stock Exchange , Network Processors , Global Unichip Corp , Last Level Cache , Global Unichip Corp Via Public Guc Announces Glink 3d Die On Interface Ip Using Tsmc N5 And N6 Process For 3dfabric Advanced Packaging Technology , ஒன்றுபட்டது மாநிலங்களில் , கேன் சென் , டைவாந் ஸ்டாக் பரிமாற்றம் , வலைப்பின்னல் ப்ராஸெஸர்ஸ் , கடந்த நிலை தற்காலிக சேமிப்பு ,