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Cloud giants to disrupt the semiconductor scene with their in-house AI accelerators?

Despite the achievements of Nvidia, companies developing their own AI models are moving towards custom chips as costs escalate, potential compatibility constraints surface, and to circumvent supply shortage from reliance on a solitary provider. ....

Tensor Processing Unit , Meta Training Inference Accelerator , Advanced Micro Devices , Global Unichip , Alchip Technologies , Ai Server , C Design , T Ce , Cloud Computing ,

Global Unichip : Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

May. 16, 2023

News Content:

Cadence 112G-LR SerDes. | May 16, 2023 ....

Glink Cowo , Sanjive Agarwala , Dan Kochpatcharin , Igor Elkanovich , Global Unichip Corp , Ip Group At Cadence , Design Infrastructure Management Division , Companies To Work , Cadence Design Systems Inc , Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy , Cadence Design Systems , Global Unichip Corp Stock Exchange , Press Release , Adence 3443 Tw0003443008 ,

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
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Dan Kochpatcharin , Igor Elkanovich , Sanjive Agarwala , Glink Cowo , Ip Group At Cadence , Global Unichip Corp , Design Infrastructure Management Division , Cadence Design Systems Inc , Design Systems , Global Unichip , Intelligent System Design ,

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

SAN JOSE, Calif., April 26, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the… ....

Sanjive Agarwala , Glink Cowo , Dan Kochpatcharin , Igor Elkanovich , Global Unichip Corp , Cadence Design Systems Inc , Ip Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy ,

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
hpcwire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from hpcwire.com Daily Mail and Mail on Sunday newspapers.

Igor Elkanovich , Glink Cowo , Sanjive Agarwala , Dan Kochpatcharin , Cadence Design Systems Inc , Global Unichip Corp , Ip Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy ,