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Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
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Sanjay Bali , Dan Kochpatcharin , Synopsys Inc , Group At Synopsys , Design Infrastructure Management Division , Synopsys Multi Die System , Universal Chiplet Interconnect Express , Product Management , Synopsys Test ,

New Electronics - Synopsys and TSMC to accelerate 2nm innovation for advanced SoC designs

Synopsys has announced that its digital and custom/analogue design flows are now certified for TSMC's N2 process technology, enabling faster delivery of advanced-node SoCs with higher quality. ....

Sanjay Bali , Synopsys Foundation , Group At Synopsys , Product Management ,